Hughes Aircraft 2470-II Wire Bonder Control Box WD-8702-006 Rev Y with Cards

Hughes Aircraft 2470-II Wire Bonder Control Box WD-8702-006 Rev Y with Cards

This is the electronic control enclosure for the Hughes Aircraft Company Model 2470-II Automatic Wire Bonder, part number WD-8702-006 Rev Y, manufactured by Hughes Aircraft Company's Industrial Products Division in Carlsbad, California. The enclosure houses the complete card cage and control electronics that drive the 2470-II bonding system — sold as the electrical cabinet only; the wire bonder head and bonding stage are not included.

Specifications & What's Included

• Manufacturer: Hughes Aircraft Company, Industrial Products Division, Carlsbad, CA
• Model: 2470-II Automatic Wire Bonder
• Part Number: WD-8702-006 (Electrical Enclosure Assembly)
• Revision: Rev Y
• Serial Number: 682
• Overall Dimensions: 33" W x 15" D x 32" H (approximately 220 lbs)
• Card cage with labeled slots: SYS CPU, MEM, CPU, IEEE 488, SYS I/O, X-AXIS, Y-AXIS, Z-AXIS, plus spare slots
• Installed control cards include: Dual Video Processor board (Assy No. 1007820-4, VIEW Engineering, 1983); Gate Generator & Processor board (VIEW Engineering); Moore Type GP board (sections: Bonder, Ultra-Sonics, Image & EFO Fire, Keyboard, Optical Recognition); additional Hughes-marked GP boards; memory board; and further PCBs as shown in photos
• Four system ROM/EPROM chips included (WD9255-014 through WD9255-017, marked 2460 SYS VI K SCB, Topcon)
• Right-side connector panel: labeled connectors J-1001 through J-1041, including circular multi-pin connectors (J-1001, J-1002, J-1040, J-1041 series) and ribbon/D-sub style connectors (J-1011 through J-1014 series)
• Integrated ventilation/cooling with side grille panels
• Power cable attached (visible in photos)
• Electrical enclosure only — wire bonder head and bonding stage NOT included
• Freight shipping required due to size and weight

Applications

The Hughes Aircraft Model 2470-II is an automatic wire bonder used in semiconductor device assembly and microelectronics packaging. Wire bonders of this type are used to connect semiconductor die to package leads or substrates using fine gold or aluminum wire, a critical step in the production of integrated circuits, hybrid circuits, and other microelectronic components. Hughes Aircraft's Industrial Products Division produced wire bonding equipment that was widely used in defense electronics, aerospace, and commercial semiconductor manufacturing from the 1970s through the 1990s. The 2470-II is an automatic system incorporating vision-based alignment (reflected in the Dual Video Processor and Gate Generator boards), ultrasonic bonding drive, and multi-axis motion control — all managed by the electronics housed in this control enclosure. This type of equipment remains relevant to facilities maintaining legacy semiconductor assembly lines, to repair depots servicing existing 2470-series machines, and to engineers seeking spare control electronics or donor boards for system restoration.