HyBond
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HyBond 616 Ultrasonic Wire Peg Bonder X-Y Linear Stage 220V Joystick OEM 6200
HyBond
$1,200.00Was: $2,400.00HyBond 616 Ultrasonic Wire Peg Bonder X-Y Linear Stage 220V Joystick OEM 6200Benchtop ultrasonic wire and peg bonder system designed for microelectronics and semiconductor packaging applications...39856- SKU:
- 39856
- Availability:
- Usually ships within 1-2 business days of cleared payment.
- Weight:
- 242.00 LBS
- Brand:
- HyBond
- Model:
- 616
- MPN:
- 616-12
- Type:
- Ultrasonic Peg Wire Bonder
- SKU:
- 39856
- Condition:
- As-Is / For Parts or Not Working
- Seller Notes:
- Includes X-Y stage, joystick controller, foot pedals, table, and OEM 6200 cabinet. No fiber-optic light or microscope.
- Country/Region of Manufacture:
- United States
- Power Requirements:
- 220V AC
- Form Factor:
- Benchtop / Workstation Table-Mounted
- Controller:
- OEM 6200 Interface Module cabinet
- Motor Drives:
- Digiplan stepper motor drives (x2)
- Stage Type:
- X-Y Linear Stage
- Input Controls:
- Joystick controller with Step Down and Start buttons
- Foot Pedals:
- Included
- Bond Parameters:
- Home, Search, Bond; U/S Power, Time, Force adjustable
- Bond Count Display:
- Digital bond count display on front panel
- Application:
- Ultrasonic wire/peg bonding, microelectronics, semiconductor packaging
- Manufacturer Location:
- HyBond Inc., Escondido, CA 92025 USA
- Compatible With:
- Fiber-optic illuminator and microscope head (not included)
- Earthing / Grounding:
- Vermaison Earth Bonding Point panel with 1MΩ resistors
- Condition Notes:
- HyBond 616 Ultrasonic Peg Wire Bonder sold AS-IS for parts or repair. Not tested; no functionality guaranteed. Includes X-Y stage, joystick, foot pedals, table, OEM 6200 cabinet. No microscope or fiber-optic light.
$1,200.00Was: $2,400.00 -
Hybond FOS 101 Fiber Optic Microscope Light Source Lamp Power Supply 15mm
HyBond
$55.00Was: $100.00Hybond FOS 101 Fiber Optic Microscope Light Source Lamp Power Supply 15mmThe Hybond FOS 101 is a benchtop fiber optic lamp power supply designed to provide controlled, adjustable illumination for...46363- SKU:
- 46363
- Availability:
- Usually ships within 1-2 business days.
- Weight:
- 8.00 LBS
- Brand:
- Hybond
- Model:
- FOS 101
- MPN:
- FOS 101
- SKU:
- 46363
- Type:
- Fiber Optic Microscope Light Source / Lamp Power Supply
- Ferrule Size:
- 15mm
- Form Factor:
- Benchtop
- Application:
- Fiber Optic Microscope Illumination
- Calibration:
- Periodic Calibration Not Required
- Front Panel Controls:
- Rotary intensity/brightness knob, fiber optic port
- Condition:
- Used – Inspected and Tested
- Seller Notes:
- Unit only; fiber optic cable not included. Tested and working.
- Country/Region of Manufacture:
- United States
- Condition Notes:
- Hybond FOS 101 fiber optic microscope light source. Tested and in working order. Good used condition with normal cosmetic wear. Front panel port and knob intact. Power cord included.
$55.00Was: $100.00 -
HyBond 616-12 Modified Wire Bonder X-Y Linear Stage Stepper Motor 220VAC
HyBond
$2,200.00Was: $4,400.00HyBond 616-12 Modified Wire Bonder X-Y Linear Stage Stepper Motor 220VACThe HyBond 616-12 is a modified ultrasonic wire bonder configured with a motorized X-Y linear stage system for semi-automated...39836- SKU:
- 39836
- Availability:
- Usually ships within 1-2 business days.
- Weight:
- 242.00 LBS
- Brand:
- HyBond
- Model:
- 616-12
- MPN:
- 616-12
- Type:
- Modified Ultrasonic Wire Bonder with X-Y Linear Stage
- SKU:
- 39836
- Power Requirements:
- 220 VAC, F1 5A F2 0.75A F3 1A; also rated 110 VAC
- Voltage Options:
- 110 VAC or 220 VAC (selectable)
- Fuse Ratings (110V):
- F1 10A, F2 1.5A, F3 2A
- Fuse Ratings (220V):
- F1 5A, F2 0.75A, F3 1A
- Country/Region of Manufacture:
- United States
- Manufacturer Location:
- HyBond Inc., Escondido, CA 92029, USA
- Form Factor:
- Benchtop with Dedicated Work Table
- Motion System:
- X-Y Linear Stage with Stepper Motor
- Stepper Motor Controller:
- Digiplen stepper motor controllers (2x, visible in power panel)
- Interface Module:
- OEM 8200 Interface Module (visible inside power panel)
- Control Panel Designation:
- OEM 6200 (labeled on power panel)
- Bond Parameters:
- UIS, Time, Force (front-panel adjustable knobs)
- Bond Modes:
- HI UIS, LOW UIS, LOW TIME, AUTO, MAN, RUN, SEARCH HEIGHT, SET UP
- Indicators:
- HOME, SEARCH, BOND LED indicators; Bond Count digital display
- UIS Power Meter:
- Analog meter on front panel
- Joystick Controller:
- External joystick unit with STEP UP, STEP DOWN, START buttons
- High-Speed Mode:
- Push-button high-speed toggle on joystick controller
- Foot Pedals:
- Two (2) foot pedals on one shared stand
- Lighting:
- Fiber Optic Lighting
- Microscope Bracket:
- Bracket for microscope included (microscope not included)
- Earth Bonding:
- Vermaison Earth Bonding Point (1 MΩ resistors, visible on table edge)
- Bonder Designation:
- Bonder No. 19 (unit label)
- Application:
- Semiconductor wire bonding, microelectronics assembly
- What's Included:
- Power panel, work table, joystick, X-Y linear stage w/ stepper motor & controller, 2x foot pedals on stand, bonder head, microscope bracket, fiber optic lighting
- Not Included:
- Microscope, illumination source, fiber optic cable, armrest
- Condition:
- Used – Pulled from Working Environment
- Seller Notes:
- Includes power panel, table, joystick, X-Y linear stage, foot pedals (2), bonder head, microscope bracket, fiber optic lighting. 220VAC.
- Condition Notes:
- This HyBond 616-12 Modified Wire Bonder is in good used condition. Pulled from a working environment where it was actively in use. All major components present and intact. Normal wear visible on chassis and table.
$2,200.00Was: $4,400.00 -
HyBond 616-12 Ultrasonic Peg Bonder 220V Parker X-Y Stage Digiplan Stepper
HyBond
$2,200.00Was: $4,400.00HyBond 616-12 Ultrasonic Peg Bonder 220V Parker X-Y Stage Digiplan StepperBenchtop ultrasonic peg bonder for semiconductor packaging and microelectronics assembly. Uses ultrasonic vibration to bond...39215- SKU:
- 39215
- Availability:
- Usually ships within 1-2 business days.
- Weight:
- 300.00 LBS
- Brand:
- HyBond
- Model:
- 616-12
- MPN:
- 616-12
- Type:
- Ultrasonic Peg Bonder
- SKU:
- 39215
- Power Requirements:
- 220V, 50Hz; F1 10A, F2 1.5A
- Input Voltage:
- 220V AC
- Frequency:
- 50 Hz
- Fuse Ratings:
- F1: 10A, F2: 1.5A
- Form Factor:
- Benchtop with integrated steel work table
- X-Y Stage:
- Parker X-Y Linear Stage
- Stepper Motor Controllers:
- 2x Digiplan Stepper Motor Controllers
- Bond Parameters:
- U/S Power, Time, Force (front-panel knobs)
- U/S Power Meter:
- D.C. Microamperes, 0–500 µA analog meter
- Foot Switch:
- Linemaster Treadlite II Cat No. T-91-S, NEMA Type 1
- Foot Switch Rating:
- 15A 125-250VAC, 1/2HP 125-250VAC
- Joystick Controller:
- Included — Step Up/Down, Start, Stop controls
- Earth Bonding Point:
- Vermason Earth Bonding Point, 3x 1MΩ ports
- Country/Region of Manufacture:
- United States
- Manufacturer Location:
- HyBond Inc., Escondido, CA 92025, USA
- Condition:
- Used – Inspected and Tested
- Seller Notes:
- Includes Parker X-Y stage, 2 Digiplan stepper controllers, joystick, foot pedals, and power supply
- Application:
- Semiconductor packaging, microelectronics peg bonding
- Compatible With:
- Microelectronics assembly, hybrid circuit bonding
- Condition Notes:
- HyBond 616-12 Ultrasonic Peg Bonder tested and in working order. Powers on, basic functions respond correctly. Includes Parker X-Y stage, 2 Digiplan stepper controllers, joystick, and foot pedals. Normal lab wear. 220V.
$2,200.00Was: $4,400.00 -
HyBond Model 616, 614 Logic Control Card Circuit Board PCB from Wire Bonder
HyBond
$59.00Was: $130.00HyBond Model 616, 614 Logic Control Card Circuit Board PCB from Wire Bonder Condition: UsedThis used logic control board has been inspected and appears to be in good condition. It was pulled...34755- SKU:
- 34755
- Weight:
- 1.00 LBS
$59.00Was: $130.00 -
HyBond 512-10-41 Manual Ball Bonder Wire Bonder Semiconductor Bonding Machine
HyBond
$950.00Was: $1,900.00HyBond 512-10-41 Manual Ball Bonder Wire Bonder Semiconductor Bonding MachineThe HyBond 512-10-41 is a benchtop manual ball bonder used for wire bonding in semiconductor assembly and microelectronics...22586- SKU:
- 22586
- Availability:
- Usually ships within 1-2 business days.
- Weight:
- 60.00 LBS
- Brand:
- HyBond
- Model:
- 512-10-41
- MPN:
- 512-10-41
- Type:
- Manual Ball Bonder / Wire Bonding Machine
- SKU:
- 22586
- Condition:
- Used – Inspected and Tested
- Seller Notes:
- No accessories included. Microscope head not included. Two fiber optic placeholders present on mount.
- Form Factor:
- Benchtop
- Application / Use Case:
- Semiconductor wire bonding, microelectronics assembly
- Bonding Method:
- Ball Bonding (Thermosonic / Thermocompression)
- Optics Mount:
- Nikon optics mount present (microscope head not included)
- Front Panel Controls:
- US Power, Stage Temp, Set Point, Test, Cal, Option, Spot, EFO Power, Power
- Bond Parameters:
- 1st/2nd bond, US (ultrasonic), Time, Force — all via front panel knobs
- Display:
- Red LED digital display (reads 983 in photos)
- Stage:
- Heated bonding stage with temperature control
- Country/Region of Manufacture:
- United States
- Condition Notes:
- HyBond 512-10-41 Manual Ball Bonder powers on; stage and mouse assembly function correctly; switches and indicators function. Could not test full bond cycle. No accessories or microscope head included. Moderate cosmetic wear.
$950.00Was: $1,900.00