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HyBond

HyBond 616-12 Ultrasonic Peg Bonder 220V Parker X-Y Stage Digiplan Stepper

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SKU:
39215
MPN:
616-12
Condition:
Used
Availability:
Usually ships within 1-2 business days.
Weight:
300.00 LBS
Shipping:
Calculated at Checkout
  • HyBond 616-12 Ultrasonic Peg Bonder full system view with stainless steel work table, X-Y stage, bonder head, and foot pedals on floor
  • HyBond 616-12 power column side panel showing main rotary switch, amber indicator light, BONDER NO.1 label, and DB9 DEM port
  • Vermason Earth Bonding Point mounted under work table with three 1MΩ banana jack ports and center stud connector
  • HyBond Model 616-12 bonder head and Parker X-Y linear stage close-up view from rear left, showing stainless work surface and wiring
  • HyBond 616-12 front view of bonder head on work table with bonding tool assembly, manual arm rests, and joystick controller at right
  • Close-up of HyBond 616-12 ultrasonic bonding head assembly showing transducer, bonding wedge tool, wiring harness, and adjustment mechanism
  • Linemaster Treadlite II dual foot pedal switch Cat No. T-91-S, 15A 125-250VAC, NEMA Type 1 UL Enclosure 1
  • HyBond 616-12 rear panel label showing model 616-12, HyBond Inc. Escondido CA, 220V 50Hz, F1 10A F2 1.5A fuse ratings, and fuse holders
  • HyBond 616-12 full system side view showing bonder on work table with cable routing and power column
  • HyBond Model 616 front control panel showing HYBOND logo, U/S Power meter, Power switch, Force Hold, Bond Count display, and bond parameter knobs
  • HyBond 616-12 joystick controller box with Step Up, Step Down, Start, and Stop buttons and black joystick
  • Interior of HyBond 616-12 control cabinet showing main controller PCB, two Digiplan stepper motor controllers, and wiring harness
  • Close-up of HyBond 616-12 ultrasonic bonding capillary or wedge tool held in tweezers in front of bonder front panel
  • HyBond 616-12 front panel U/S Power analog meter reading D.C. Microamperes, 0 to 500 µA scale
$2,200.00
Was: $4,400.00
Current Stock: 1

Sold Out

Description

HyBond 616-12 Ultrasonic Peg Bonder 220V Parker X-Y Stage Digiplan Stepper

Benchtop ultrasonic peg bonder for semiconductor packaging and microelectronics assembly. Uses ultrasonic vibration to bond wire and component leads to hybrid circuits and integrated circuit packages.

Specifications & What's Included

  • Power: 220V AC, 50Hz (F1 10A, F2 1.5A fuses)
  • X-Y positioning: Parker linear stage with 2x Digiplan stepper motor controllers
  • Bond control: Front-panel knobs for ultrasonic power, time, and force
  • Ultrasonic power meter: 0–500 µA analog display
  • Foot pedal: Linemaster Treadlite II (15A 125-250VAC, 1/2HP rated)
  • Joystick controller with step, start, and stop functions
  • Earth bonding point with 3x 1MΩ ports
  • Integrated steel work table

Applications

Ultrasonic peg bonders are standard equipment in hybrid microcircuit assembly and semiconductor packaging, particularly for attaching component leads and wire bonds to circuit substrates. This model supports microelectronics manufacturing workflows requiring controlled ultrasonic bonding with XY stage positioning. Commonly used in contract manufacturing and in-house assembly operations for military, aerospace, and commercial electronics.

Condition: Used
This HyBond 616-12 Ultrasonic Peg Bonder has been powered and tested at our facility and is in good working order. It powers on and its basic functions respond as expected. The bonder head, X-Y stage, joystick controller, foot pedals, and front-panel controls all appear to be intact and present. The unit shows normal wear consistent with prior lab use — the work surface and housing show light surface marks and scuffing typical of a production machine. The included Linemaster Treadlite II dual foot pedal shows wear on the tread surfaces. Please view our photo set and contact us if you have any questions.
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Warranty Information

We stand behind every item we sell with a 30-day money-back guarantee. If your item arrives not as described, you may return it within 30 days for a full refund. Please inspect your purchase upon arrival and contact us with any questions.
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Additional Information

Brand:
HyBond
Model:
616-12
MPN:
616-12
Type:
Ultrasonic Peg Bonder
SKU:
39215
Power Requirements:
220V, 50Hz; F1 10A, F2 1.5A
Input Voltage:
220V AC
Frequency:
50 Hz
Fuse Ratings:
F1: 10A, F2: 1.5A
Form Factor:
Benchtop with integrated steel work table
X-Y Stage:
Parker X-Y Linear Stage
Stepper Motor Controllers:
2x Digiplan Stepper Motor Controllers
Bond Parameters:
U/S Power, Time, Force (front-panel knobs)
U/S Power Meter:
D.C. Microamperes, 0–500 µA analog meter
Foot Switch:
Linemaster Treadlite II Cat No. T-91-S, NEMA Type 1
Foot Switch Rating:
15A 125-250VAC, 1/2HP 125-250VAC
Joystick Controller:
Included — Step Up/Down, Start, Stop controls
Earth Bonding Point:
Vermason Earth Bonding Point, 3x 1MΩ ports
Country/Region of Manufacture:
United States
Manufacturer Location:
HyBond Inc., Escondido, CA 92025, USA
Condition:
Used – Inspected and Tested
Seller Notes:
Includes Parker X-Y stage, 2 Digiplan stepper controllers, joystick, foot pedals, and power supply
Application:
Semiconductor packaging, microelectronics peg bonding
Compatible With:
Microelectronics assembly, hybrid circuit bonding
Condition Notes:
HyBond 616-12 Ultrasonic Peg Bonder tested and in working order. Powers on, basic functions respond correctly. Includes Parker X-Y stage, 2 Digiplan stepper controllers, joystick, and foot pedals. Normal lab wear. 220V.
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HyBond 616 Ultrasonic Wire Peg Bonder X-Y Linear Stage 220V Joystick OEM 6200

HyBond

$1,200.00
Was: $2,400.00
HyBond 616 Ultrasonic Wire Peg Bonder X-Y Linear Stage 220V Joystick OEM 6200Benchtop ultrasonic wire and peg bonder system designed for microelectronics and semiconductor packaging applications...
39856
SKU:
39856
Availability:
Usually ships within 1-2 business days of cleared payment.
Weight:
242.00 LBS
Brand:
HyBond
Model:
616
MPN:
616-12
Type:
Ultrasonic Peg Wire Bonder
SKU:
39856
Condition:
As-Is / For Parts or Not Working
Seller Notes:
Includes X-Y stage, joystick controller, foot pedals, table, and OEM 6200 cabinet. No fiber-optic light or microscope.
Country/Region of Manufacture:
United States
Power Requirements:
220V AC
Form Factor:
Benchtop / Workstation Table-Mounted
Controller:
OEM 6200 Interface Module cabinet
Motor Drives:
Digiplan stepper motor drives (x2)
Stage Type:
X-Y Linear Stage
Input Controls:
Joystick controller with Step Down and Start buttons
Foot Pedals:
Included
Bond Parameters:
Home, Search, Bond; U/S Power, Time, Force adjustable
Bond Count Display:
Digital bond count display on front panel
Application:
Ultrasonic wire/peg bonding, microelectronics, semiconductor packaging
Manufacturer Location:
HyBond Inc., Escondido, CA 92025 USA
Compatible With:
Fiber-optic illuminator and microscope head (not included)
Earthing / Grounding:
Vermaison Earth Bonding Point panel with 1MΩ resistors
Condition Notes:
HyBond 616 Ultrasonic Peg Wire Bonder sold AS-IS for parts or repair. Not tested; no functionality guaranteed. Includes X-Y stage, joystick, foot pedals, table, OEM 6200 cabinet. No microscope or fiber-optic light.
HyBond 616-12 Modified Wire Bonder full system view on stainless steel work table with power panel cabinet and joystick controller HyBond 616-12 power panel cabinet detail showing main isolator rotary switch, amber indicator lamp, and OEM 6200 DB9 connector
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HyBond 616-12 Modified Wire Bonder X-Y Linear Stage Stepper Motor 220VAC

HyBond

$2,200.00
Was: $4,400.00
HyBond 616-12 Modified Wire Bonder X-Y Linear Stage Stepper Motor 220VACThe HyBond 616-12 is a modified ultrasonic wire bonder configured with a motorized X-Y linear stage system for semi-automated...
39836
SKU:
39836
Availability:
Usually ships within 1-2 business days.
Weight:
242.00 LBS
Brand:
HyBond
Model:
616-12
MPN:
616-12
Type:
Modified Ultrasonic Wire Bonder with X-Y Linear Stage
SKU:
39836
Power Requirements:
220 VAC, F1 5A F2 0.75A F3 1A; also rated 110 VAC
Voltage Options:
110 VAC or 220 VAC (selectable)
Fuse Ratings (110V):
F1 10A, F2 1.5A, F3 2A
Fuse Ratings (220V):
F1 5A, F2 0.75A, F3 1A
Country/Region of Manufacture:
United States
Manufacturer Location:
HyBond Inc., Escondido, CA 92029, USA
Form Factor:
Benchtop with Dedicated Work Table
Motion System:
X-Y Linear Stage with Stepper Motor
Stepper Motor Controller:
Digiplen stepper motor controllers (2x, visible in power panel)
Interface Module:
OEM 8200 Interface Module (visible inside power panel)
Control Panel Designation:
OEM 6200 (labeled on power panel)
Bond Parameters:
UIS, Time, Force (front-panel adjustable knobs)
Bond Modes:
HI UIS, LOW UIS, LOW TIME, AUTO, MAN, RUN, SEARCH HEIGHT, SET UP
Indicators:
HOME, SEARCH, BOND LED indicators; Bond Count digital display
UIS Power Meter:
Analog meter on front panel
Joystick Controller:
External joystick unit with STEP UP, STEP DOWN, START buttons
High-Speed Mode:
Push-button high-speed toggle on joystick controller
Foot Pedals:
Two (2) foot pedals on one shared stand
Lighting:
Fiber Optic Lighting
Microscope Bracket:
Bracket for microscope included (microscope not included)
Earth Bonding:
Vermaison Earth Bonding Point (1 MΩ resistors, visible on table edge)
Bonder Designation:
Bonder No. 19 (unit label)
Application:
Semiconductor wire bonding, microelectronics assembly
What's Included:
Power panel, work table, joystick, X-Y linear stage w/ stepper motor & controller, 2x foot pedals on stand, bonder head, microscope bracket, fiber optic lighting
Not Included:
Microscope, illumination source, fiber optic cable, armrest
Condition:
Used – Pulled from Working Environment
Seller Notes:
Includes power panel, table, joystick, X-Y linear stage, foot pedals (2), bonder head, microscope bracket, fiber optic lighting. 220VAC.
Condition Notes:
This HyBond 616-12 Modified Wire Bonder is in good used condition. Pulled from a working environment where it was actively in use. All major components present and intact. Normal wear visible on chassis and table.