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HyBond

HyBond 616 Ultrasonic Wire Peg Bonder X-Y Linear Stage 220V Joystick OEM 6200

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SKU:
39856
MPN:
616-12
Condition:
Used
Availability:
Usually ships within 1-2 business days of cleared payment.
Weight:
242.00 LBS
Shipping:
Calculated at Checkout
  • HyBond 616 Ultrasonic Peg Bonder mounted on stainless steel work table with OEM 6200 control cabinet – full front view
  • Vermaison Earth Bonding Point panel with yellow banana jacks and 1MΩ resistors mounted under table; Bonder No. 21 red label visible
  • HyBond Model 616 bonder head on work surface with joystick controller to the right – three-quarter view
  • HyBond Model 616 front control panel showing Home/Search/Bond indicators, U/S Power meter, Bond Count display, and Bond Parameters knobs
  • HyBond 616 ultrasonic bonding tool/transducer assembly close-up showing wedge tool tip and actuator mechanism
  • HyBond joystick controller unit with ball joystick, Step Down and Start pushbuttons, and amber/green/red indicator lights
  • OEM 6200 control cabinet interior showing main controller PCB and interface module with ribbon cable connections
  • OEM 6200 cabinet interior lower section showing two Digiplan stepper motor drives, circuit breaker, FEA power supply unit, and wiring
  • HyBond 616 bonder on stainless table – rear three-quarter view showing power cable and rear chassis
  • HyBond 616 rear panel showing cooling fan, power inlet, and partial rear label (HyBond Inc., Escondido, CA)
  • HyBond 616 rear label close-up: HyBond Inc. Escondido CA 92025 USA, Model 616, serial number, fuse ratings, voltage and Hz markings
  • OEM 6200 control cabinet door showing Main Isolator lockout switch (yellow/red), Power On amber indicator, and DB9 connector
$1,200.00
Was: $2,400.00
Current Stock: 1

Sold Out

Description

HyBond 616 Ultrasonic Wire Peg Bonder X-Y Linear Stage 220V Joystick OEM 6200

Benchtop ultrasonic wire and peg bonder system designed for microelectronics and semiconductor packaging applications. Equipment features motorized X-Y linear stage with joystick control, adjustable bonding parameters, and digital bond counting.

Specifications & What's Included

  • Model: HyBond 616 (MPN: 616-12)
  • Power: 220V AC
  • X-Y Linear Stage with dual Digiplan stepper motor drives
  • OEM 6200 control cabinet interface
  • Joystick controller with Step Down and Start buttons
  • Foot pedals included
  • Adjustable ultrasonic power, time, and force parameters
  • Digital bond count display
  • Workstation table mount
  • Vermaison Earth Bonding Point panel

Applications

Wire peg bonding equipment is used in semiconductor manufacturing for interconnecting microelectronic components and creating solder connections in integrated circuit packaging. The HyBond 616 supports both wire and peg bonding processes with programmable search, home, and bond sequences. Compatible with optional fiber-optic illumination and microscope systems for enhanced visibility during bonding operations.

Condition: For Parts or Not Working
This HyBond Model 616 Ultrasonic Peg Wire Bonder is being sold AS-IS for parts or repair. Due to its age, we are not able to verify functionality, and no working guarantee is made. The bonder head, X-Y linear stage, joystick controller, foot pedals, work table, and OEM 6200 controller cabinet with Digiplan stepper motor drives are all present and appear complete. Cosmetically the unit looks good overall — the table surface has light wear, the bonder chassis shows normal age-related patina, and the control panels appear intact with labels legible. The fiber-optic light source and microscope head are not included. Please view our photo set and contact us if you have any questions.
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Warranty Information

We stand behind every item we sell with a 30-day money-back guarantee. If your item arrives not as described, you may return it within 30 days for a full refund. Please inspect your purchase upon arrival and contact us with any questions.
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Additional Information

Brand:
HyBond
Model:
616
MPN:
616-12
Type:
Ultrasonic Peg Wire Bonder
SKU:
39856
Condition:
As-Is / For Parts or Not Working
Seller Notes:
Includes X-Y stage, joystick controller, foot pedals, table, and OEM 6200 cabinet. No fiber-optic light or microscope.
Country/Region of Manufacture:
United States
Power Requirements:
220V AC
Form Factor:
Benchtop / Workstation Table-Mounted
Controller:
OEM 6200 Interface Module cabinet
Motor Drives:
Digiplan stepper motor drives (x2)
Stage Type:
X-Y Linear Stage
Input Controls:
Joystick controller with Step Down and Start buttons
Foot Pedals:
Included
Bond Parameters:
Home, Search, Bond; U/S Power, Time, Force adjustable
Bond Count Display:
Digital bond count display on front panel
Application:
Ultrasonic wire/peg bonding, microelectronics, semiconductor packaging
Manufacturer Location:
HyBond Inc., Escondido, CA 92025 USA
Compatible With:
Fiber-optic illuminator and microscope head (not included)
Earthing / Grounding:
Vermaison Earth Bonding Point panel with 1MΩ resistors
Condition Notes:
HyBond 616 Ultrasonic Peg Wire Bonder sold AS-IS for parts or repair. Not tested; no functionality guaranteed. Includes X-Y stage, joystick, foot pedals, table, OEM 6200 cabinet. No microscope or fiber-optic light.
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HyBond 616-12 Ultrasonic Peg Bonder full system view with stainless steel work table, X-Y stage, bonder head, and foot pedals on floor HyBond 616-12 power column side panel showing main rotary switch, amber indicator light, BONDER NO.1 label, and DB9 DEM port
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HyBond 616-12 Ultrasonic Peg Bonder 220V Parker X-Y Stage Digiplan Stepper

HyBond

$2,200.00
Was: $4,400.00
HyBond 616-12 Ultrasonic Peg Bonder 220V Parker X-Y Stage Digiplan StepperBenchtop ultrasonic peg bonder for semiconductor packaging and microelectronics assembly. Uses ultrasonic vibration to bond...
39215
SKU:
39215
Availability:
Usually ships within 1-2 business days.
Weight:
300.00 LBS
Brand:
HyBond
Model:
616-12
MPN:
616-12
Type:
Ultrasonic Peg Bonder
SKU:
39215
Power Requirements:
220V, 50Hz; F1 10A, F2 1.5A
Input Voltage:
220V AC
Frequency:
50 Hz
Fuse Ratings:
F1: 10A, F2: 1.5A
Form Factor:
Benchtop with integrated steel work table
X-Y Stage:
Parker X-Y Linear Stage
Stepper Motor Controllers:
2x Digiplan Stepper Motor Controllers
Bond Parameters:
U/S Power, Time, Force (front-panel knobs)
U/S Power Meter:
D.C. Microamperes, 0–500 µA analog meter
Foot Switch:
Linemaster Treadlite II Cat No. T-91-S, NEMA Type 1
Foot Switch Rating:
15A 125-250VAC, 1/2HP 125-250VAC
Joystick Controller:
Included — Step Up/Down, Start, Stop controls
Earth Bonding Point:
Vermason Earth Bonding Point, 3x 1MΩ ports
Country/Region of Manufacture:
United States
Manufacturer Location:
HyBond Inc., Escondido, CA 92025, USA
Condition:
Used – Inspected and Tested
Seller Notes:
Includes Parker X-Y stage, 2 Digiplan stepper controllers, joystick, foot pedals, and power supply
Application:
Semiconductor packaging, microelectronics peg bonding
Compatible With:
Microelectronics assembly, hybrid circuit bonding
Condition Notes:
HyBond 616-12 Ultrasonic Peg Bonder tested and in working order. Powers on, basic functions respond correctly. Includes Parker X-Y stage, 2 Digiplan stepper controllers, joystick, and foot pedals. Normal lab wear. 220V.
HyBond 616-12 Modified Wire Bonder full system view on stainless steel work table with power panel cabinet and joystick controller HyBond 616-12 power panel cabinet detail showing main isolator rotary switch, amber indicator lamp, and OEM 6200 DB9 connector
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HyBond 616-12 Modified Wire Bonder X-Y Linear Stage Stepper Motor 220VAC

HyBond

$2,200.00
Was: $4,400.00
HyBond 616-12 Modified Wire Bonder X-Y Linear Stage Stepper Motor 220VACThe HyBond 616-12 is a modified ultrasonic wire bonder configured with a motorized X-Y linear stage system for semi-automated...
39836
SKU:
39836
Availability:
Usually ships within 1-2 business days.
Weight:
242.00 LBS
Brand:
HyBond
Model:
616-12
MPN:
616-12
Type:
Modified Ultrasonic Wire Bonder with X-Y Linear Stage
SKU:
39836
Power Requirements:
220 VAC, F1 5A F2 0.75A F3 1A; also rated 110 VAC
Voltage Options:
110 VAC or 220 VAC (selectable)
Fuse Ratings (110V):
F1 10A, F2 1.5A, F3 2A
Fuse Ratings (220V):
F1 5A, F2 0.75A, F3 1A
Country/Region of Manufacture:
United States
Manufacturer Location:
HyBond Inc., Escondido, CA 92029, USA
Form Factor:
Benchtop with Dedicated Work Table
Motion System:
X-Y Linear Stage with Stepper Motor
Stepper Motor Controller:
Digiplen stepper motor controllers (2x, visible in power panel)
Interface Module:
OEM 8200 Interface Module (visible inside power panel)
Control Panel Designation:
OEM 6200 (labeled on power panel)
Bond Parameters:
UIS, Time, Force (front-panel adjustable knobs)
Bond Modes:
HI UIS, LOW UIS, LOW TIME, AUTO, MAN, RUN, SEARCH HEIGHT, SET UP
Indicators:
HOME, SEARCH, BOND LED indicators; Bond Count digital display
UIS Power Meter:
Analog meter on front panel
Joystick Controller:
External joystick unit with STEP UP, STEP DOWN, START buttons
High-Speed Mode:
Push-button high-speed toggle on joystick controller
Foot Pedals:
Two (2) foot pedals on one shared stand
Lighting:
Fiber Optic Lighting
Microscope Bracket:
Bracket for microscope included (microscope not included)
Earth Bonding:
Vermaison Earth Bonding Point (1 MΩ resistors, visible on table edge)
Bonder Designation:
Bonder No. 19 (unit label)
Application:
Semiconductor wire bonding, microelectronics assembly
What's Included:
Power panel, work table, joystick, X-Y linear stage w/ stepper motor & controller, 2x foot pedals on stand, bonder head, microscope bracket, fiber optic lighting
Not Included:
Microscope, illumination source, fiber optic cable, armrest
Condition:
Used – Pulled from Working Environment
Seller Notes:
Includes power panel, table, joystick, X-Y linear stage, foot pedals (2), bonder head, microscope bracket, fiber optic lighting. 220VAC.
Condition Notes:
This HyBond 616-12 Modified Wire Bonder is in good used condition. Pulled from a working environment where it was actively in use. All major components present and intact. Normal wear visible on chassis and table.