HyBond 616-12 Modified Wire Bonder X-Y Linear Stage Stepper Motor 220VAC

HyBond 616-12 Modified Wire Bonder X-Y Linear Stage Stepper Motor 220VAC

The HyBond 616-12 is a modified ultrasonic wire bonder configured with a motorized X-Y linear stage system for semi-automated bonding operations. The Model 616 bonder head mounts on the X-Y stage, which is driven by stepper motors and controlled through an integrated power panel housing an OEM 8200 interface module and dual Digiplen stepper motor controllers. The system is designed for precision wire bonding of microelectronic devices and hybrid circuits, with external joystick and foot pedal inputs for operator control of stage movement and bond actuation.

Specifications & What's Included

• Make / Model: HyBond Inc. Model 616-12 (Modified Bonder)
• Manufacturer: HyBond Inc., Escondido, CA 92029, USA
• Power Input: 220 VAC (also rated for 110 VAC — see rear data plate for fuse values per voltage)
• Fuse Ratings at 220 VAC: F1 5A, F2 0.75A, F3 1A
• Fuse Ratings at 110 VAC: F1 10A, F2 1.5A, F3 2A
• Motion System: X-Y linear stage with stepper motor drive
• Stepper Motor Controllers: Two (2) Digiplen stepper motor controller modules (mounted in power panel)
• Interface Module: OEM 8200 interface module PCB with ribbon cable connections
• Power Panel: Standalone cabinet with main isolator rotary switch, amber power indicator, OEM 6200 DB9 connector port, and circuit breaker
• Front Panel Controls: HOME / SEARCH / BOND LED indicators; UIS, Time, Force adjustment knobs; analog UIS Power meter; digital Bond Count display; bond mode switches (HI UIS, LOW UIS, LOW TIME, AUTO, MAN, RUN, SEARCH HEIGHT, SET UP); POWER and FORCE HOLD switches
• Joystick Controller: External handheld unit with trackball joystick, STEP UP / STEP DOWN / START buttons, and PUSH FOR HIGH SPEED toggle
• Foot Pedals: Two (2) foot pedals mounted on a single shared stand
• Bonder Head: HyBond Model 616 ultrasonic bonder head with bonding needle/wedge tool installed
• Work Table: Dedicated stainless steel work table with blue ESD work surface pad
• Earth Bonding: Vermaison Earth Bonding Point (1 MΩ resistors) mounted to table edge
• Microscope Bracket: Bracket for microscope mounting included
• Lighting: Fiber optic lighting included
• Not Included: Microscope, illumination source, fiber optic cable, armrest

Applications

Wire bonders are used in microelectronics assembly to create electrical interconnections between a semiconductor die and its package leads or substrate using fine gold, aluminum, or copper wire. The HyBond 616 is an ultrasonic wedge bonder — a platform widely used in hybrid circuit assembly, RF/microwave device packaging, sensor manufacturing, and prototype or low-to-medium volume production bonding. The addition of a motorized X-Y linear stage converts the base bonder into a semi-automated system, allowing the operator to position the work piece under the bond head with motorized precision rather than purely manual manipulation. This type of modified semi-automated bonder is common in research and development labs, university cleanrooms, aerospace and defense electronics shops, and contract assembly facilities that require more repeatable positioning than a manual bonder affords but do not need the throughput of a fully automated bonder. HyBond (HyBond Inc., Escondido, California) produced wire bonders for the semiconductor and hybrid microelectronics industry from the 1970s through the early 2000s, and their Model 616-series machines remain in active use in legacy production and research settings.