Description
HyBond 512-10-41 Manual Ball Bonder Wire Bonder Semiconductor Bonding Machine
The HyBond 512-10-41 is a benchtop manual ball bonder used for wire bonding in semiconductor assembly and microelectronics manufacturing. It uses thermocompression or thermosonic bonding techniques to form ball bonds connecting fine gold or aluminum wire between die pads and package leads. The front panel provides direct manual control of all bond parameters — ultrasonic power, bond time, and bond force for both first and second bonds — along with a heated stage with digital temperature readout and an electronic flame-off (EFO) circuit for ball formation.
Specifications & What's Included
- Manufacturer: HyBond
- Model: 512-10-41
- Type: Manual Ball Bonder (Thermocompression / Thermosonic)
- Form Factor: Benchtop
- Front Panel Controls: 1st / 2nd bond select, Ultrasonic (US) Power, Time, Force (bond parameters); Stage Temp (°C), Set Point; Test, Cal; Option, Spot; EFO Power; main Power switch
- Display: Red LED digital readout (stage temperature)
- Bonding Stage: Heated stage with temperature control
- Optics Mount: Nikon optics mount present — two fiber optic placeholders included on mount
- Microscope Head: Not included
- Mouse Assembly: Present and functional
- Accessories: None included
- Power: Connected via rear panel (cable present — see rear label for voltage specifications)
Applications
Manual ball bonders like the HyBond 512 series are used in semiconductor packaging, hybrid microelectronics, MEMS assembly, and research and development environments where fine wire interconnects are needed between integrated circuit die and package substrates or lead frames. They are a standard tool in prototype and low-volume production bonding operations, university microelectronics labs, and failure analysis or repair work where automated bonding equipment is impractical. HyBond has been a well-known manufacturer of manual bonding equipment in the U.S. for decades, and the 512 series machines are widely used in both production support roles and lab settings. The operator controls bond parameters manually via the front panel, making these machines well-suited for development work, process qualification, and situations requiring flexibility across different wire types, die sizes, or package geometries.
This HyBond 512-10-41 Manual Ball Bonder powers on and has been confirmed functional to the extent we were able to test it. The stage and mouse assembly operate correctly, and the front panel switches and indicators all function. We were not able to test the full bonding cycle beyond these points. The Nikon optics mount is present with two fiber optic placeholders, but the microscope head is not included. No accessories are included. The unit shows moderate cosmetic wear on the cabinet exterior consistent with lab use; the work table surface has some light surface marks. A label on the rear panel is partially obscured. Please view our photo set and contact us if you have any questions.
Warranty Information
Additional Information
Brand: |
HyBond |
Model: |
512-10-41 |
MPN: |
512-10-41 |
Type: |
Manual Ball Bonder / Wire Bonding Machine |
SKU: |
22586 |
Condition: |
Used – Inspected and Tested |
Seller Notes: |
No accessories included. Microscope head not included. Two fiber optic placeholders present on mount. |
Form Factor: |
Benchtop |
Application / Use Case: |
Semiconductor wire bonding, microelectronics assembly |
Bonding Method: |
Ball Bonding (Thermosonic / Thermocompression) |
Optics Mount: |
Nikon optics mount present (microscope head not included) |
Front Panel Controls: |
US Power, Stage Temp, Set Point, Test, Cal, Option, Spot, EFO Power, Power |
Bond Parameters: |
1st/2nd bond, US (ultrasonic), Time, Force — all via front panel knobs |
Display: |
Red LED digital display (reads 983 in photos) |
Stage: |
Heated bonding stage with temperature control |
Country/Region of Manufacture: |
United States |
Condition Notes: |
HyBond 512-10-41 Manual Ball Bonder powers on; stage and mouse assembly function correctly; switches and indicators function. Could not test full bond cycle. No accessories or microscope head included. Moderate cosmetic wear. |