Unbranded Wafer Semiconductor Process Chuck Assembly w/ Mesh Gas Dist Fittings

Semiconductor Wafer Process Chuck Assembly w/ Mesh Gas Dist Fittings Thermocouple

This is a wafer process chuck assembly used in semiconductor fabrication equipment. The unit features a circular fine wire mesh face -- consistent with backside gas distribution or showerhead-style gas delivery -- recessed into a flat top plate and secured with a multi-screw concentric ring pattern. The body is a D-shaped (tombstone-profile) enclosure constructed in stainless steel or hard-anodized aluminum with finned side panels and perimeter fasteners throughout. Three threaded tube fittings are present on the end face, likely serving coolant (water) and process gas lines. Thermocouple and signal wiring is attached and included as shown. No manufacturer markings, model numbers, or part numbers are legible on any surface of the unit.

Specifications & What's Included

• Type: Wafer process chuck assembly
• Housing shape: D-shaped / tombstone profile enclosure
• Housing material: Stainless steel or hard-anodized aluminum (unconfirmed)
• Top face: Circular fine wire mesh gas distribution or vacuum distribution surface
• Mesh retention: Concentric screw ring, multiple fasteners
• Tube fittings: 3 threaded compression-style fittings on end face (fluid/gas ports)
• Additional fittings: 2 smaller threaded fittings on top surface
• Wiring: Black and white thermocouple/signal wiring attached and included
• Fasteners: Multiple perimeter screws securing top plate and side panels
• Brand / Model / Part Number: Not legible -- no identifying labels visible
• Includes: Chuck assembly with attached tubing and wiring; no mounting hardware or documentation

Applications

Wafer chuck assemblies are core components inside semiconductor process chambers, used to hold, support, and condition silicon wafers during fabrication steps such as plasma etching (RIE/ICP), chemical vapor deposition (CVD), physical vapor deposition (PVD), or similar vacuum-based processes. The mesh face on this chuck is consistent with backside helium gas delivery -- a technique used to improve thermal contact between the wafer and the chuck surface, allowing precise temperature control during processing. The multiple fluid fittings suggest an active coolant loop for chuck temperature regulation, which is standard in high-power etch and deposition tools. Thermocouple wiring provides real-time temperature feedback to the process controller. Chucks of this form factor are typically matched to a specific OEM process tool (such as those from Applied Materials, Lam Research, Tokyo Electron, or similar manufacturers), and compatibility with a particular chamber must be confirmed before installation. This type of component is sought after for replacement, refurbishment, or spare-parts use in existing semiconductor fabs and R&D tool sets.