HyBond

Hybond 512-06X-08 Ultrasonic Wedge Wire Bonder Nikon SMZ-1 Microscope AS-IS

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SKU:
42702
MPN:
512-06x-08
Condition:
Used
Availability:
Currently out of stock — contact us for availability.
Weight:
65.00 LBS
Shipping:
Calculated at Checkout
  • Hybond 512-06X-08 ultrasonic wedge wire bonder front view with Nikon SMZ-1 stereo zoom microscope and foot pedal
  • Hybond 512-06X-08 wire bonder rear panel view showing power connections, fuses, and rating label; foot pedal visible at right
  • Hybond 512-06X-08 rear rating label showing model 512-06X-08, serial number 1067, 110V 50/60Hz, and fuse ratings F1 10A F2 1.5A
  • Hybond Model 512 front control panel showing U/S, Time, and Force bond parameter knobs, LED stage temperature display, U/S Power meter, F-Hold, Spot, and Power switch
  • Hybond 512-06X-08 rotating work stage with bonding arm and wedge tool positioned over stage surface
  • Nikon SMZ-1 stereo zoom microscope head mounted on Hybond 512 wire bonder, close-up of zoom body and focus knobs
  • Nikon SMZ-1 binocular microscope body showing empty eyepiece tubes and zoom adjustment knob — no eyepieces installed
  • Hybond Model 512 front panel close-up showing Point, Test buttons and illuminated Power switch with red indicator light on
  • Hybond wire bonder tension adjustment knob close-up on bonding head assembly
  • Hybond 512-06X-08 foot pedal showing wear and paint chips on housing, ribbed pedal surface
  • Hybond 512-06x-08 UItlrasonic Wedge Wire Bonder Nikon SMZ-1 Head -AS-IS
  • Hybond 512-06x-08 UItlrasonic Wedge Wire Bonder Nikon SMZ-1 Head -AS-IS
$686.00
Was: $1,500.00

This item is temporarily unavailable. Please view our recommended, in-stock alternatives directly below.

Description

Hybond 512-06X-08 Ultrasonic Wedge Wire Bonder Nikon SMZ-1 Microscope AS-IS

The Hybond 512-06X-08 is a benchtop ultrasonic wedge wire bonder designed for precision microelectronic interconnection. This unit powers on — the power indicator light illuminates and front-panel controls are present — but the LED stage/temperature display shows no readout. The fault has not been diagnosed. It is being sold strictly AS-IS for parts or repair.

Specifications & What's Included

  • Manufacturer: Hybond, Inc., Escondido, CA USA
  • Model: 512-06X-08
  • Type: Ultrasonic wedge wire bonder
  • Form factor: Benchtop
  • Power: 110V, 50/60Hz
  • Fuse F1: 10A (Stage Stitch); Fuse F2: 1.5A
  • Front-panel bond parameters: U/S (ultrasonic power), Time, Force — rotary dial controls
  • LED digital display: present but shows no readout (AS-IS fault)
  • Analog U/S Power meter on front panel
  • Front-panel controls: Stage Temp °C, Set Point, Test, F-Hold, Spot, Power switch
  • Rotating circular work stage with bonding arm and wedge tool
  • Tension adjustment knob on bonding head
  • Included: Nikon SMZ-1 Stereo Zoom Microscope (mounted) — no eyepieces
  • Included: Foot pedal (shows paint chipping and general wear)

Applications

Ultrasonic wedge wire bonders like the Hybond 512 series are used in semiconductor device assembly, hybrid microelectronics, and microelectromechanical systems (MEMS) packaging. The wedge bonding process joins fine aluminum or gold wire between a die bond pad and a substrate or leadframe using ultrasonic energy combined with pressure and heat, forming a reliable electrical interconnect without melting the wire. The Hybond 512 was a workhorse instrument in semiconductor production and R&D labs from the 1980s through the 1990s, commonly found in IC packaging lines, university research facilities, and government/defense electronics labs. The integrated Nikon SMZ-1 stereo zoom microscope allows the operator to view the bond site during setup and operation. This unit is suited for a buyer who can repair or cannibalize it for parts — the bonding head, stage, microscope mount, and foot pedal assembly may all hold value for Hybond 512 owners needing spares.

Condition: For Parts or Not Working
This Hybond 512-06X-08 ultrasonic wedge wire bonder powers on, but the LED display shows no readout. The cause has not been diagnosed, and the unit is being sold AS-IS for parts or repair — no functionality is guaranteed. The Nikon SMZ-1 stereo zoom microscope is mounted and included, but has no eyepieces. The foot pedal is also included. The foot pedal housing shows paint chipping and general wear. The bonding head, stage, and front-panel controls appear intact. Please view our photo set and contact us if you have any questions.
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Warranty Information

We stand behind every item we sell with a 30-day money-back guarantee. If your item arrives not as described, you may return it within 30 days for a full refund. Please inspect your purchase upon arrival and contact us with any questions.
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Additional Information

Brand:
Hybond
Model:
512-06X-08
MPN:
512-06X-08
Type:
Ultrasonic Wedge Wire Bonder
SKU:
42702
Seller Notes:
Includes Nikon SMZ-1 stereo zoom microscope (no eyepieces) and foot pedal
Country/Region of Manufacture:
United States
Form Factor:
Benchtop
Power Requirements:
110V, 50/60Hz
Fuse Rating:
F1: 10A (Stage Stitch), F2: 1.5A
Bonding Method:
Ultrasonic Wedge
Bond Parameters:
U/S, Time, Force (front-panel rotary controls)
Stage:
Rotating circular work stage with arm assembly
Display:
LED digital display (not functioning — AS-IS)
Microscope Included:
Nikon SMZ-1 Stereo Zoom Microscope (no eyepieces)
Accessories Included:
Foot pedal
Application:
Semiconductor wire bonding, microelectronics assembly
Manufacturer Location:
Hybond, Inc., Escondido, CA 92025 USA
Condition Notes:
Hybond 512-06X-08 ultrasonic wedge wire bonder powers on but shows no LED display readout. Sold AS-IS for parts or repair — not guaranteed functional. Includes Nikon SMZ-1 microscope (no eyepieces) and foot pedal.
California Prop 65 Warning:
WARNING: This product can expose you to chemicals including lead and lead compounds, and DEHP (a phthalate), which are known to the State of California to cause cancer and birth defects or other reproductive harm. Go to P65Warnings.ca.gov
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HyBond 512-10-41 Manual Ball Bonder full front-left view showing green cabinet, front panel controls, Nikon optics mount assembly, bonding stage, and work table with mouse assembly in foreground HyBond 512-10-41 close-up of Nikon optics mount and transducer head assembly with dual focus knobs and bond tip visible
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HyBond 512-10-41 Manual Ball Bonder Wire Bonder Semiconductor Bonding Machine

HyBond

$941.00
Was: $1,900.00
HyBond 512-10-41 Manual Ball Bonder Wire Bonder Semiconductor Bonding MachineThe HyBond 512-10-41 is a benchtop manual ball bonder used for wire bonding in semiconductor assembly and microelectronics...
22586
SKU:
22586
Availability:
Usually ships within 1-2 business days.
Weight:
60.00 LBS
Brand:
Hybond
Model:
512-10-41
MPN:
512-10-41
Type:
Manual Ball Bonder / Wire Bonding Machine
SKU:
22586
Condition:
Used – Inspected and Tested
Seller Notes:
No accessories included. Microscope head not included. Two fiber optic placeholders present on mount.
Form Factor:
Benchtop
Application / Use Case:
Semiconductor wire bonding, microelectronics assembly
Bonding Method:
Ball Bonding (Thermosonic / Thermocompression)
Optics Mount:
Nikon optics mount present (microscope head not included)
Front Panel Controls:
US Power, Stage Temp, Set Point, Test, Cal, Option, Spot, EFO Power, Power
Bond Parameters:
1st/2nd bond, US (ultrasonic), Time, Force — all via front panel knobs
Display:
Red LED digital display (reads 983 in photos)
Stage:
Heated bonding stage with temperature control
Country/Region of Manufacture:
United States
Condition Notes:
HyBond 512-10-41 Manual Ball Bonder powers on; stage and mouse assembly function correctly; switches and indicators function. Could not test full bond cycle. No accessories or microscope head included. Moderate cosmetic wear.
California Prop 65 Warning:
WARNING: This product can expose you to chemicals including lead and lead compounds, and DEHP (a phthalate), which are known to the State of California to cause cancer and birth defects or other reproductive harm. Go to P65Warnings.ca.gov