Water Cooled Jacket 20" Dia Sputtering Vacuum Bell Jar Chamber RF Coil Aluminum

Water Cooled Jacket 20" Dia Sputtering Vacuum Bell Jar Chamber RF Coil Aluminum

This is an unbranded aluminum water cooled jacket designed to surround a vacuum bell jar chamber used in sputtering and physical vapor deposition (PVD) processes. The jacket is 20 inches in diameter and 19 inches deep. It features an array of brass compression water fittings on the exterior for connection to a recirculating chiller or cooling water supply, and mounts via a set of latching clamps visible around the outer shell. A small axial cooling fan is mounted on the jacket body. Internally, the jacket contains RF coils and a copper tubing manifold intended for inductive heating of the chamber environment.

Specifications & What's Included

• Type: Water cooled jacket for vacuum bell jar / sputtering chamber
• Material: Aluminum construction
• Diameter: 20 inches
• Depth: 19 inches
• Cooling: Water cooled via external brass compression fittings
• Internal RF coils included – for inductive heating
• Internal copper tubing manifold (water circuit) – present and visually intact
• Cooling fan: Small axial fan mounted on jacket body
• Exterior latching clamps for securing jacket to chamber
• Sold as-is – not tested; water flow, cooling function, and RF coil continuity unverified
• Freight shipment required due to size and weight

Applications

Water cooled jackets like this one are used in thin film deposition systems — most commonly in DC magnetron sputtering, RF sputtering, and related PVD processes — where a vacuum bell jar sits within the jacket during deposition runs. The water cooling circuit removes heat generated during plasma operation, protecting the chamber walls and maintaining stable process temperatures. The integrated RF coils allow inductive heating of the chamber interior, which is used for substrate preheating or outgassing prior to deposition. These jackets are a standard component in research and small-scale production PVD systems found in semiconductor fabrication, optics coating, thin film research labs, and materials science facilities. They were widely used from the 1970s through the 1990s in bell jar sputtering systems before dedicated load-locked cluster tools became standard, though bell jar systems remain in use today in research and university settings for their simplicity and flexibility.