Power Distribution Control Panel RFX 600 208VAC 115VAC Cathode Supply System

Power Distribution Control Panel RFX 600 208VAC 115VAC Cathode Supply System Control

This is a rackmount power distribution and control panel built to interface with RFX 600 RF power supply systems used in semiconductor plasma processing equipment. The panel consolidates AC power distribution and signal routing for the RFX 600 power supply and associated instruments into a single rack-mounted enclosure. It accepts two separate AC inputs — 208 VAC for the RFX 600 and 115 VAC for instruments — and routes power and control signals through a set of clearly labeled connector sections on the rear and top surfaces.

Specifications & What's Included

• Type: Rackmount power distribution and control panel
• Compatible system: RFX 600 RF power supply
• RFX 600 input: 208 VAC, twist-lock receptacle (front panel)
• Instruments input: 115 VAC, twist-lock receptacle (front panel)
• Output receptacles (top): Instruments — 15A, 125V twist-lock; RFX 600 P/S — 15A, 250V twist-lock
• Rear signal connectors — labeled sections: EPO, System Control, J205, Bias, Cathode P/S, Etch, RFX 600 P/S
• Cathode Supply section: DB9 male connector + circular multi-pin connector
• System Control: circular multi-pin connectors (front and rear)
• EPO: circular multi-pin connector
• Bias connector: DB15
• Etch connector: DB15
• Interior: wired terminal blocks, signal routing harness, twist-lock outlet bodies
• Form factor: rackmount enclosure with black front panel face
• No manufacturer name or brand markings visible on unit
• Unit only — no additional accessories included

Applications

The RFX 600 is a high-frequency RF power supply used in plasma-assisted semiconductor fabrication processes, including plasma etching and physical vapor deposition (PVD). Panels like this one serve as the centralized power distribution and control hub within such tool sets — routing mains AC power to the RF supply and instrument subsystems, while providing organized signal breakout for system control, EPO (Emergency Power Off), cathode supply, bias, and etch functions. This type of integration panel was common in semiconductor capital equipment from the 1990s and early 2000s, where tool integrators would build custom distribution panels to manage the multiple power and signal interfaces required by high-power RF sources. The labeled connector groupings (Bias, Etch, Cathode P/S, EPO) are characteristic of plasma etch or sputter deposition tool architectures. These panels are typically found in semiconductor fabrication facilities, R&D labs, and university cleanrooms running plasma process tools.