Innotec DS-28C High Vacuum Batch Sputtering System 208V 3Ph 60A For Parts

Innotec DS-28C High Vacuum Batch Sputtering System 208V 3Ph 60A For Parts

The Innotec DS-28C is a high vacuum batch sputtering system designed for physical vapor deposition (PVD) processes including DC magnetron and RF sputtering. It consists of a two-section stainless steel vacuum chamber with an integrated control and RF matching network enclosure. This unit is being sold as-is for refurbishment or parts — it is not complete and is not guaranteed functional. It was removed from an R&D fabrication facility that no longer needed it.

Specifications & What's Included

• Manufacturer: Innotec Group Inc., Simi Valley, CA
• Model: DS-28C
• Part No.: 260730
• Power: 208 VAC, 3-Phase / 5-Wire, 60 Hz, 60 Amps
• Upper Chamber: approx. 27" Diameter x 17" Tall
• Lower Chamber: approx. 21" Diameter x 20" Tall
• Overall System Dimensions: 80" x 47" x 77"
• Approximate Weight: 1,800 lbs — freight shipping required
• Transformer: Burton Equipment Div. (Cerritos, CA), SPEC #16845 — PRI: 208/240 VAC, SEC: 117 VAC, 1.5 kVA, 3-Phase
• Throttle Valve: MEVAC Vari-Q, Model VQ-6-ASA-T-PA (qty 1)
• Vacuum Variable Capacitor: ITT Jennings CVCJ-1000-3S, 7–1000 pF, 3000V (qty 1)
• Vacuum Variable Capacitor: ITT Jennings CSVF-500-0010, 12–500 pF, 10 kV (qty 1)
• Vacuum Variable Capacitor: Jennings CVDD-1000-15S, 25–1000 pF, 15 kV (qty 1)
• Vacuum Variable Capacitor: Jennings CVDD-500-15S, 20–500 pF, 15 kV (qty 1)
• Mass Flow Meter: MKS Model 1279A22CR1BV (qty 1)
• Controller Card/Board: DISON Technologies PWP AMC068 / CCA AMC069 (qty 1)
• Panel Meters: Innotec Voltage Panel Meter (qty 1); Innotec AMT Panel Controller (qty 2); Innotec Hoist Control Panel (qty 1)
• RF Power Meters: Incident & Reflected RF Blower Power Meters, Model 7900006010 (qty 2)
• Stepping Motor: Superior Electric Type SS50G20 (qty 1)
• Segmented sputter target assembly with radial spoke pattern visible in photos (copper, bolted flange mount)
• H.V.A. Mfg. Inc. vacuum flange component (visible on chamber frame)
• Internal pneumatic plumbing, wiring harnesses, and vacuum tubing

Applications

High vacuum batch sputtering systems like the Innotec DS-28C are used in physical vapor deposition (PVD) to deposit thin films of metal or compound materials onto substrates such as silicon wafers, optical components, and precision parts. In a typical batch process, multiple substrates are loaded into the chamber, the system is pumped down to high vacuum, and a plasma discharge is struck to sputter material from a target onto the substrate surfaces. This class of equipment was widely used in semiconductor device fabrication, optical coating, hard disk media production, and R&D thin-film research through the 1980s and 1990s. RF and DC magnetron configurations — both of which this system appears to support based on its RF matching network components and vacuum capacitor bank — allow deposition of both conductive and dielectric materials. The ITT Jennings vacuum variable capacitors are characteristic components of the RF impedance matching network used to couple RF power efficiently into the plasma. The MKS mass flow meter controls process gas flow (typically argon) into the chamber. Systems of this type remain relevant today for legacy process maintenance, university research labs, and buyers seeking to refurbish or cannibalize high-value sub-components such as the Jennings vacuum capacitors, MEVAC throttle valve, and MKS flow controller.