Custom Heavy Duty Hot Plate 5.75in Dia 750°F 250V 30A w/ Cover & Thermocouple

Custom Heavy Duty Hot Plate 5.75in Dia 750°F 250V 30A w/ Cover & Thermocouple

This is a custom-built, heavy-duty hot plate designed for semiconductor wafer processing and high-temperature lab applications. It features a 5.75-inch diameter circular heating element with a concentric-ring surface pattern and a larger 7.75 × 11.5-inch upper stainless steel surface plate. The unit was powered and confirmed to heat up at our facility. Internal resistance measures 15.4 Ohms and has been verified free of short circuits. Originally used for curing silicon wafers, this hot plate was designed to be paired with an external power supply and temperature controller.

Specifications & What's Included

• Heating element diameter: 5.75 in (circular, concentric-ring pattern)
• Upper surface plate dimensions: 7.75 × 11.5 in
• Maximum tested temperature: 750°F
• Internal resistance: 15.4 Ohms (verified, no short circuits)
• Voltage rating: 250V
• Current rating: 30A
• Phase: Single phase
• Power inlet: 30A 250V locking connector (NEMA L6-30 style), rear-mounted
• Temperature sensor: Braided-cable thermocouple with spring-tip probe and multi-pin circular connector (included)
• Enclosure: Heavy-gauge aluminum and stainless steel construction with perforated mesh base for ventilation
• Includes: Custom gas-containment cover with hinged lid and side handles (designed to hold process gas over the heating surface)
• Note: External power supply and temperature controller required for operation (not included)

Applications

Hot plates of this type are used throughout semiconductor fabrication and materials science for processes that require precise, sustained surface heat. Common applications include curing and annealing silicon wafers, baking photoresist layers after spin-coating (soft bake and post-exposure bake steps in photolithography), and thermally processing thin-film substrates. The custom gas-containment cover allows a controlled atmosphere — such as a forming gas or inert gas blanket — to be maintained over the wafer during processing, which is important for oxidation-sensitive materials. This type of equipment is found in university research labs, small-scale semiconductor pilot lines, MEMS fabrication, and R&D environments where a compact, benchtop high-temperature platform is needed. The unit would serve as a functional heating base for anyone building or rebuilding a custom wafer processing workstation, with the addition of a suitable temperature controller (such as a PID controller) and an appropriate power supply.