Wire Bonders
Wire bonders are specialized machines used in the semiconductor industry for connecting integrated circuits with tiny wires. These machines are essential for creating reliable and precise electrical connections in electronic devices. Wire bonders use thermocompression or ultrasonic bonding techniques to attach thin wires to semiconductor components, ensuring stable and durable connections. The process requires a high level of precision and accuracy to guarantee the functionality and performance of the final product. Wire bonders play a crucial role in the manufacturing process of electronic devices, ensuring that the connections between components are secure and reliable.
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Hughes 2460 HMC-2460 Automatic Wire Bonder WD-8700D1 Rev F w/ Panasonic WV-5350
Hughes
$4,000.00Was: $8,000.00Hughes 2460 HMC-2460 Automatic Wire Bonder WD-8700D1 Rev F w/ Panasonic WV-5350The Hughes Aircraft Model 2460 (also identified as HMC-2460) is a semi-automatic thermosonic/thermocompression wire...51542- SKU:
- 51542
- Availability:
- Usually ships within 5-10 business days — freight shipment required due to size and weight.
- Weight:
- 762.00 LBS
- Brand:
- Hughes Aircraft
- Model:
- 2460
- MPN:
- WD-8700D1
- Secondary Model:
- HMC-2460
- Type:
- Automatic Wire Bonder System
- Revision:
- Rev F
- SKU:
- 51542
- Seller Notes:
- Includes Panasonic WV-5350 video monitor and Hughes operator's manual
- Country/Region of Manufacture:
- United States
- Manufacturer Division:
- Hughes Aircraft Company – Industrial Products Division, Carlsbad, CA
- Application / Use Case:
- Semiconductor wire bonding, IC packaging, microelectronics assembly
- Included Video Monitor:
- Panasonic WV-5350
- Monitor Power Requirements:
- 120V AC 60Hz 23W / 12V DC 0.9A
- Monitor Input:
- 1 Vp-p, 75 Ohm
- Monitor Connectors:
- BNC Video IN/OUT, BNC Sync IN/OUT
- Microscope:
- Bausch & Lomb stereo binocular microscope
- Control System:
- Internal card cage with multiple PCB controller boards
- Front Panel Controls:
- Electronic Flame Off, Fiber Light Source, Flow Rate, Feed, Tension
- Overall Dimensions:
- 48" W x 37" D x 66" H
- Condition:
- Used – Not Fully Tested at Facility
- Form Factor:
- Freestanding Benchtop System on Integrated Cabinet
- Included Documentation:
- Hughes Automatic Wire Bonder Operator's Manual
- Condition Notes:
- Hughes 2460 HMC-2460 Automatic Wire Bonder WD-8700D1 could not be fully tested at our facility. Sold in as-found condition. Appears complete with monitor, microscope, card cage, and operator's manual. Please contact us with questions.
- California Prop 65 Warning:
- WARNING: This product can expose you to chemicals including lead and lead compounds, and DEHP (a phthalate), which are known to the State of California to cause cancer and birth defects or other reproductive harm. Go to P65Warnings.ca.gov
$4,000.00Was: $8,000.00 -
Hughes Aircraft Model 2500 Hybrid Automatic Die Bonder w/ Operator's Guide - AS
Hughes
$5,300.00Was: $10,600.00Hughes Aircraft Model 2500 Hybrid Automatic Die Bonder w/ Operator's Guide Benchtop automatic die bonding system designed for hybrid microelectronics assembly. Supports both eutectic and epoxy...50538- SKU:
- 50538
- Availability:
- This item requires freight shipping — please contact us for a shipping quote before purchasing.
- Weight:
- 895.00 LBS
- Brand:
- Hughes Aircraft
- Model:
- 2500
- MPN:
- Model 2500
- SKU:
- 50538
- Condition:
- Used – Inspected, Not Bench-Tested
- Seller Notes:
- Includes Operator's Guide and Maintenance Manual
- Form Factor:
- Benchtop / Floor-Standing Workstation
- Country of Manufacture:
- USA
- Overall Dimensions:
- 62" W x 37" D x 73" H
- Application / Use Case:
- Hybrid Microelectronics Die Bonding / Die Attach
- Machine Type:
- Automatic Die Bonder
- Bonding Method:
- Hybrid Die Bonding (Eutectic / Epoxy capable)
- Control Interface:
- Hughes Industrial Products keyboard controller with LED display
- Vision System:
- Panasonic CRT monitor with integrated camera
- Air / Vacuum:
- Air and dual vacuum ports (J2050 panel)
- Force Control:
- Adjustable via front panel Force Control knob
- Fiber Light Source:
- Integrated fiber optic illumination with brightness control
- Connector Types:
- Multi-pin circular connectors: J2041, J2051, J2052, J2023, J2034
- Shipping Method:
- Freight Required
- Includes:
- Operator's Guide, Maintenance Manual, card cage with boards
- Compatible With:
- Hybrid microelectronics production lines, semiconductor packaging
- Condition Notes:
- Hughes Aircraft Model 2500 Hybrid Automatic Die Bonder sold AS-IS / FOR PARTS OR NOT WORKING. This unit has been visually inspected only and is not tested for operational functionality.
- California Prop 65 Warning:
- WARNING: This product can expose you to chemicals including lead and lead compounds, and DEHP (a phthalate), which are known to the State of California to cause cancer and birth defects or other reproductive harm. Go to P65Warnings.ca.gov
$5,300.00Was: $10,600.00 -
Hughes Aircraft 2470-II Wire Bonder Control Box WD-8702-006 Rev Y with Cards
Hughes
$1,200.00Was: $2,400.00Hughes Aircraft 2470-II Wire Bonder Control Box WD-8702-006 Rev Y with CardsThis is the electronic control enclosure for the Hughes Aircraft Company Model 2470-II Automatic Wire Bonder, part number...50489- SKU:
- 50489
- Availability:
- Usually ships within 3-5 business days via freight carrier — please contact us to arrange shipment.
- Weight:
- 216.00 LBS
- Brand:
- Hughes Aircraft
- Model:
- 2470-II
- MPN:
- WD-8702-006
- Secondary Model:
- WD-8702-006 Rev Y
- Type:
- Automatic Wire Bonder Electronic Control Enclosure
- SKU:
- 50489
- Revision:
- Rev Y
- Series:
- 2470-II Automatic Wire Bonder
- Seller Notes:
- Electrical enclosure with control cards only — bonder head not included. Freight shipping required.
- Country/Region of Manufacture:
- United States
- Form Factor:
- Freestanding Cabinet / Floor-Standing Enclosure
- Overall Dimensions:
- 33" W x 15" D x 32" H
- Application:
- Semiconductor Wire Bonding — Automatic Wire Bonder Control
- Includes:
- Control cards and boards as shown in photos
- What's NOT Included:
- Wire bonder head / bonding machine — enclosure only
- Condition:
- Used – Powers On, Not Fully Tested
- Shipping Method:
- Freight shipping required due to size and weight
- Condition Notes:
- Hughes Aircraft 2470-II Wire Bonder Control Box WD-8702-006 Rev Y powers on but has not been fully tested. Control cards included as shown. Enclosure only — bonder not included. ~220 lbs, freight shipping required.
- California Prop 65 Warning:
- WARNING: This product can expose you to chemicals including lead and lead compounds, and DEHP (a phthalate), which are known to the State of California to cause cancer and birth defects or other reproductive harm. Go to P65Warnings.ca.gov
$1,200.00Was: $2,400.00 -
Hughes Aircraft WD-8702-001 Rev Y 2470-II Wire Bonder Electronic Control Box
Hughes
$1,100.00Was: $2,200.00Hughes Aircraft WD-8702-001 Rev Y 2470-II Wire Bonder Electronic Control BoxElectronic control enclosure for Hughes 2470-II Series wire bonders. Manages motion control and system I/O for...50488- SKU:
- 50488
- Availability:
- This item requires freight shipping due to its size and weight; please contact us for a freight quote before ordering.
- Weight:
- 216.00 LBS
- Brand:
- Hughes Aircraft
- Model:
- WD-8702-001
- MPN:
- WD-8702-001
- Secondary Model:
- 2470-II
- Hardware Revision:
- Rev. Y
- Type:
- Wire Bonder Electronic Control Enclosure
- SKU:
- 50488
- Series:
- 2470-II
- Manufacturer Division:
- Industrial Products Division
- Country/Region of Manufacture:
- United States
- Form Factor:
- Freestanding Cabinet / Floor-Standing Enclosure
- Dimensions:
- 33" W x 15" D x 32" H (approx.)
- Includes:
- Electronic control boards, power cabling, internal wiring harness
- Card Slots / Board Positions:
- Multi-slot card cage; slots labeled SYS CPU, MEM, IDX CPU, IEEE 488, SYS I/O, X-Axis, Y-Axis, Z-Axis, Spare
- Internal Power Supply:
- Xentek Inc. WD-9553 Rev C (D/C 4-89, SN/409)
- External Connectors:
- BNC connectors J-1001 through J-1005, J-1011; multi-pin connector
- Compatible With:
- Hughes 2470-II Series Wire Bonder
- Condition:
- Used – Powers On, Not Fully Tested
- Seller Notes:
- Electrical enclosure only — wire bonder head not included. Boards shown in photos included. Freight shipping required.
- Application:
- Semiconductor wire bonding — motion control and system I/O
- Shipping Method:
- Freight required due to size and weight
- Condition Notes:
- Hughes WD-8702-001 Rev Y wire bonder control enclosure powers on but has not been fully tested. Boards shown in photos included. Enclosure only — bonder not included. Freight shipping required. Not guaranteed fully functional.
- California Prop 65 Warning:
- WARNING: This product can expose you to chemicals including lead and lead compounds, and DEHP (a phthalate), which are known to the State of California to cause cancer and birth defects or other reproductive harm. Go to P65Warnings.ca.gov
$1,100.00Was: $2,200.00 -
Hughes 2460-II Automatic Gold Wire Ball Bonder with Accessories Shown - Palomar
Hughes
$3,769.00Was: $15,000.00Hughes 2460-II Automatic Gold Wire Ball Bonder with Accessories Shown - Palomar Hughes Aircraft Bonding Division was purchased by Palomar Includes assortment of accessories as shown in the photos...50461- SKU:
- 50461
- Weight:
- 839.00 LBS
- California Prop 65 Warning:
- WARNING: This product can expose you to chemicals including lead and lead compounds, and DEHP (a phthalate), which are known to the State of California to cause cancer and birth defects or other reproductive harm. Go to P65Warnings.ca.gov
$3,769.00Was: $15,000.00 -
Dage MF-22A Microtester 22 Wire Bond Pull Shear Tester Semiconductor For Parts
Dage
$900.00Was: $5,000.00Dage MF-22A Microtester 22 Wire Bond Pull Shear Tester Semiconductor For PartsThe Dage MF-22A Microtester 22 is a benchtop wire bond pull and shear tester designed for quantitative mechanical...49957- SKU:
- 49957
- Availability:
- Usually ships within 1-2 business days.
- Weight:
- 75.00 LBS
- California Prop 65 Warning:
- WARNING: This product can expose you to chemicals including lead and lead compounds, and DEHP (a phthalate), which are known to the State of California to cause cancer and birth defects or other reproductive harm. Go to P65Warnings.ca.gov
$900.00Was: $5,000.00 -
Hughes WD-12778 Interface Unit Palomar Automatic Wedge Wire Bonder ISA PC6502
Hughes
$550.00Was: $1,100.00Hughes WD-12778 Interface Unit Palomar Automatic Wedge Wire Bonder ISA PC6502Interface and communication unit for Hughes Palomar automatic wedge wire bonding equipment. Manages data transfer and...48777- SKU:
- 48777
- Availability:
- Usually ships within 1–2 business days.
- Weight:
- 12.00 LBS
- Brand:
- Hughes
- Model:
- WD-12778
- MPN:
- WD-12778
- Secondary Model:
- WD12783 / WD13007
- Type:
- Interface / Communication Unit
- SKU:
- 48777
- Compatible With:
- Hughes Palomar Automatic Wedge Wire Bonder
- Included Boards:
- PC6502, DMA-16/PDMA-16, SCB-411/411E, A60653 I/O, 4-Slot ISA
- Floppy Drive:
- TEAC FD-235HF 1.44MB (P/N 193077C2-91)
- Bus Type:
- ISA
- Main Controller Chip:
- ALi (ALI) chipset on PC6502 DMA-16 board (Rev C)
- Rear Connectors:
- COM 1 HOST, COM 2 HOST (DB9), HOST-COGNEX DATA (DB25)
- Additional Connectors:
- P1101, P1102 BNC/coax ports; multi-pin connector
- Front Panel:
- Power LED, Reset button, DIN connector, 3.5" floppy bay
- Form Factor:
- Rackmount Enclosure / Module
- Application:
- Semiconductor Wire Bonding Equipment
- Condition:
- Used – Pulled from Working Environment
- Seller Notes:
- Pulled from Hughes Palomar wire bonder; all listed boards and floppy drive included
- Country/Region of Manufacture:
- United States
- Condition Notes:
- Hughes WD-12778 Interface Unit pulled from a Palomar Automatic Wedge Wire Bonder. Blue enclosure shows surface scuffs and industrial wear. All boards present; not bench-tested at our facility. Sold as-removed.
- California Prop 65 Warning:
- WARNING: This product can expose you to chemicals including lead and lead compounds, and DEHP (a phthalate), which are known to the State of California to cause cancer and birth defects or other reproductive harm. Go to P65Warnings.ca.gov
$550.00Was: $1,100.00 -
Hughes 2470-V Palomar Automatic Wedge Wire Bonder Aluminum & Gold - Bad CMOS Bat
Hughes
$11,827.00Was: $30,000.00Hughes 2470-V Palomar Automatic Wedge Wire Bonder Aluminum & Gold - Bad CMOS Bat Aluminum and Gold wire bonding Cycle Time: 750ms per wire with an approximate wire length of 0.025 inches Table...17438- SKU:
- 17438
- Weight:
- 760.00 LBS
- California Prop 65 Warning:
- WARNING: This product can expose you to chemicals including lead and lead compounds, and DEHP (a phthalate), which are known to the State of California to cause cancer and birth defects or other reproductive harm. Go to P65Warnings.ca.gov
$11,827.00Was: $30,000.00 -
HyBond 616 Ultrasonic Wire Peg Bonder X-Y Linear Stage 220V Joystick OEM 6200
HyBond
$1,200.00Was: $2,400.00HyBond 616 Ultrasonic Wire Peg Bonder X-Y Linear Stage 220V Joystick OEM 6200Benchtop ultrasonic wire and peg bonder system designed for microelectronics and semiconductor packaging applications...39856- SKU:
- 39856
- Availability:
- Usually ships within 1-2 business days of cleared payment.
- Weight:
- 242.00 LBS
- Brand:
- Hybond
- Model:
- 616
- MPN:
- 616-12
- Type:
- Ultrasonic Peg Wire Bonder
- SKU:
- 39856
- Condition:
- As-Is / For Parts or Not Working
- Seller Notes:
- Includes X-Y stage, joystick controller, foot pedals, table, and OEM 6200 cabinet. No fiber-optic light or microscope.
- Country/Region of Manufacture:
- United States
- Power Requirements:
- 220V AC
- Form Factor:
- Benchtop / Workstation Table-Mounted
- Controller:
- OEM 6200 Interface Module cabinet
- Motor Drives:
- Digiplan stepper motor drives (x2)
- Stage Type:
- X-Y Linear Stage
- Input Controls:
- Joystick controller with Step Down and Start buttons
- Foot Pedals:
- Included
- Bond Parameters:
- Home, Search, Bond; U/S Power, Time, Force adjustable
- Bond Count Display:
- Digital bond count display on front panel
- Application:
- Ultrasonic wire/peg bonding, microelectronics, semiconductor packaging
- Manufacturer Location:
- HyBond Inc., Escondido, CA 92025 USA
- Compatible With:
- Fiber-optic illuminator and microscope head (not included)
- Earthing / Grounding:
- Vermaison Earth Bonding Point panel with 1MΩ resistors
- Condition Notes:
- HyBond 616 Ultrasonic Peg Wire Bonder sold AS-IS for parts or repair. Not tested; no functionality guaranteed. Includes X-Y stage, joystick, foot pedals, table, OEM 6200 cabinet. No microscope or fiber-optic light.
- California Prop 65 Warning:
- WARNING: This product can expose you to chemicals including lead and lead compounds, and DEHP (a phthalate), which are known to the State of California to cause cancer and birth defects or other reproductive harm. Go to P65Warnings.ca.gov
$1,200.00Was: $2,400.00 -
Semiconductor Equipment Corp 4450 Hot Gas Rework Wire Bond Inspection Station
Semiconductor Equip
$325.00Was: $650.00Semiconductor Equipment Corp 4450 Hot Gas Rework Wire Bond Inspection StationBenchtop station designed for wire bond rework and hot gas rework operations on semiconductor components. Combines...46476- SKU:
- 46476
- Availability:
- Usually ships within 1-2 business days.
- Weight:
- 30.00 LBS
- Brand:
- Semiconductor Equipment Corp
- Model:
- 4450
- MPN:
- 4450
- Type:
- Hot Gas Rework & Wire Bond Inspection Station
- SKU:
- 46476
- Condition:
- As-Is / For Parts or Not Working
- Seller Notes:
- Includes all components shown in photos: stage, inspection lamp, gas flow meter, pressure gauge, articulating arm, cables
- Country/Region of Manufacture:
- United States
- Power Requirements:
- 110V AC, 1A, 60Hz, Single Phase
- Voltage:
- 110V AC
- Amperage:
- 1A
- Phase:
- Single Phase
- Frequency:
- 60 Hz
- Form Factor:
- Benchtop
- Application:
- Wire Bond Rework, Hot Gas Rework, Semiconductor Inspection
- Gas Controls:
- Gas Temperature control, Gas Flow meter (Dwyer rotameter, 0–20 scale)
- Stage:
- Flat work stage with articulating inspection/bond arm
- Included Components:
- Gooseneck inspection lamp, pressure gauge, gas flow rotameter, work stage, articulating arm, power cable
- Condition Notes:
- Semiconductor Equipment Corp 4450 Hot Gas Wire Bond Station sold as-is for parts/repair. Not tested or guaranteed functional. All components in photos included: console, stage, arm, lamp, gas controls, cables. Cosmetic wear throughout.
- California Prop 65 Warning:
- WARNING: This product can expose you to chemicals including lead and lead compounds, and DEHP (a phthalate), which are known to the State of California to cause cancer and birth defects or other reproductive harm. Go to P65Warnings.ca.gov
$325.00Was: $650.00 -
Kulicke & Soffa 1484 Automatic Wedge Wire Bonder K&S Semiconductor Die Bond
Kulicke & Soffa
$3,300.00Was: $6,600.00Kulicke & Soffa 1484 Automatic Wedge Wire Bonder K&S Semiconductor Die BondAutomatic wedge wire bonder for semiconductor die attachment and microelectronics packaging. Uses ultrasonic aluminum wire...44840- SKU:
- 44840
- Availability:
- Usually ships within 5-10 business days — contact us for freight and rigging details on this large equipment item.
- Weight:
- 830.00 LBS
- Brand:
- Kulicke & Soffa
- Model:
- 1484
- MPN:
- 1484
- Type:
- Automatic Wedge Wire Bonder
- SKU:
- 44840
- Condition:
- Used – Pulled from Working Environment
- Application:
- Semiconductor Die Bonding, Microelectronics Packaging
- Bonding Method:
- Wedge (Ultrasonic)
- Wire Type:
- Aluminum Wire
- Automation Level:
- Automatic
- Form Factor:
- Floor-Standing / Freestanding Cabinet
- Control System:
- Integrated control cabinet with card cage and CRT monitor
- Vision System:
- Integrated CRT monitor with camera head (camera head port visible)
- Pneumatic System:
- 3-gauge pressure panel: electrode, bond head cooling, wirefeed; vacuum gauge included
- Servo Motor:
- Electro-Craft servo (P/N 1140-001-0729, customer P/N 1482-1079-000)
- DC Motor:
- Globe Motors P/N JCO-322 / 283-1010-000, 27 VDC, date code J9017
- Card Cage:
- Multi-slot card cage with labeled control boards (1402, 1422, 1462 series)
- Front Panel Controls:
- Emergency Stop, Cancel, Index, Auto Windup, Enter, Stop
- Camera Interface:
- Camera Head, Video, Ext/Video, CN1 (DB25), 1A fused IEC power
- Country/Region of Manufacture:
- United States
- Seller Notes:
- Unit includes integrated control cabinet, pneumatic panel, servo motors, vision system, and work stage. Sold as shown.
- Condition Notes:
- Kulicke & Soffa 1484 Wedge Wire Bonder pulled from a working environment where it was in use and functional. Inspected and in good condition. Cabinet shows normal production wear.
- California Prop 65 Warning:
- WARNING: This product can expose you to chemicals including lead and lead compounds, and DEHP (a phthalate), which are known to the State of California to cause cancer and birth defects or other reproductive harm. Go to P65Warnings.ca.gov
$3,300.00Was: $6,600.00 -
HyBond 616-12 Modified Wire Bonder X-Y Linear Stage Stepper Motor 220VAC
HyBond
$2,200.00Was: $4,400.00HyBond 616-12 Modified Wire Bonder X-Y Linear Stage Stepper Motor 220VACThe HyBond 616-12 is a modified ultrasonic wire bonder configured with a motorized X-Y linear stage system for semi-automated...39836- SKU:
- 39836
- Availability:
- Usually ships within 1-2 business days.
- Weight:
- 242.00 LBS
- Brand:
- Hybond
- Model:
- 616-12
- MPN:
- 616-12
- Type:
- Modified Ultrasonic Wire Bonder with X-Y Linear Stage
- SKU:
- 39836
- Power Requirements:
- 220 VAC, F1 5A F2 0.75A F3 1A; also rated 110 VAC
- Voltage Options:
- 110 VAC or 220 VAC (selectable)
- Fuse Ratings (110V):
- F1 10A, F2 1.5A, F3 2A
- Fuse Ratings (220V):
- F1 5A, F2 0.75A, F3 1A
- Country/Region of Manufacture:
- United States
- Manufacturer Location:
- HyBond Inc., Escondido, CA 92029, USA
- Form Factor:
- Benchtop with Dedicated Work Table
- Motion System:
- X-Y Linear Stage with Stepper Motor
- Stepper Motor Controller:
- Digiplen stepper motor controllers (2x, visible in power panel)
- Interface Module:
- OEM 8200 Interface Module (visible inside power panel)
- Control Panel Designation:
- OEM 6200 (labeled on power panel)
- Bond Parameters:
- UIS, Time, Force (front-panel adjustable knobs)
- Bond Modes:
- HI UIS, LOW UIS, LOW TIME, AUTO, MAN, RUN, SEARCH HEIGHT, SET UP
- Indicators:
- HOME, SEARCH, BOND LED indicators; Bond Count digital display
- UIS Power Meter:
- Analog meter on front panel
- Joystick Controller:
- External joystick unit with STEP UP, STEP DOWN, START buttons
- High-Speed Mode:
- Push-button high-speed toggle on joystick controller
- Foot Pedals:
- Two (2) foot pedals on one shared stand
- Lighting:
- Fiber Optic Lighting
- Microscope Bracket:
- Bracket for microscope included (microscope not included)
- Earth Bonding:
- Vermaison Earth Bonding Point (1 MΩ resistors, visible on table edge)
- Bonder Designation:
- Bonder No. 19 (unit label)
- Application:
- Semiconductor wire bonding, microelectronics assembly
- What's Included:
- Power panel, work table, joystick, X-Y linear stage w/ stepper motor & controller, 2x foot pedals on stand, bonder head, microscope bracket, fiber optic lighting
- Not Included:
- Microscope, illumination source, fiber optic cable, armrest
- Condition:
- Used – Pulled from Working Environment
- Seller Notes:
- Includes power panel, table, joystick, X-Y linear stage, foot pedals (2), bonder head, microscope bracket, fiber optic lighting. 220VAC.
- Condition Notes:
- This HyBond 616-12 Modified Wire Bonder is in good used condition. Pulled from a working environment where it was actively in use. All major components present and intact. Normal wear visible on chassis and table.
- California Prop 65 Warning:
- WARNING: This product can expose you to chemicals including lead and lead compounds, and DEHP (a phthalate), which are known to the State of California to cause cancer and birth defects or other reproductive harm. Go to P65Warnings.ca.gov
$2,200.00Was: $4,400.00 -
HyBond 616-12 Ultrasonic Peg Bonder 220V Parker X-Y Stage Digiplan Stepper
HyBond
$2,200.00Was: $4,400.00HyBond 616-12 Ultrasonic Peg Bonder 220V Parker X-Y Stage Digiplan StepperBenchtop ultrasonic peg bonder for semiconductor packaging and microelectronics assembly. Uses ultrasonic vibration to bond...39215- SKU:
- 39215
- Availability:
- Usually ships within 1-2 business days.
- Weight:
- 300.00 LBS
- Brand:
- Hybond
- Model:
- 616-12
- MPN:
- 616-12
- Type:
- Ultrasonic Peg Bonder
- SKU:
- 39215
- Power Requirements:
- 220V, 50Hz; F1 10A, F2 1.5A
- Input Voltage:
- 220V AC
- Frequency:
- 50 Hz
- Fuse Ratings:
- F1: 10A, F2: 1.5A
- Form Factor:
- Benchtop with integrated steel work table
- X-Y Stage:
- Parker X-Y Linear Stage
- Stepper Motor Controllers:
- 2x Digiplan Stepper Motor Controllers
- Bond Parameters:
- U/S Power, Time, Force (front-panel knobs)
- U/S Power Meter:
- D.C. Microamperes, 0–500 µA analog meter
- Foot Switch:
- Linemaster Treadlite II Cat No. T-91-S, NEMA Type 1
- Foot Switch Rating:
- 15A 125-250VAC, 1/2HP 125-250VAC
- Joystick Controller:
- Included — Step Up/Down, Start, Stop controls
- Earth Bonding Point:
- Vermason Earth Bonding Point, 3x 1MΩ ports
- Country/Region of Manufacture:
- United States
- Manufacturer Location:
- HyBond Inc., Escondido, CA 92025, USA
- Condition:
- Used – Inspected and Tested
- Seller Notes:
- Includes Parker X-Y stage, 2 Digiplan stepper controllers, joystick, foot pedals, and power supply
- Application:
- Semiconductor packaging, microelectronics peg bonding
- Compatible With:
- Microelectronics assembly, hybrid circuit bonding
- Condition Notes:
- HyBond 616-12 Ultrasonic Peg Bonder tested and in working order. Powers on, basic functions respond correctly. Includes Parker X-Y stage, 2 Digiplan stepper controllers, joystick, and foot pedals. Normal lab wear. 220V.
- California Prop 65 Warning:
- WARNING: This product can expose you to chemicals including lead and lead compounds, and DEHP (a phthalate), which are known to the State of California to cause cancer and birth defects or other reproductive harm. Go to P65Warnings.ca.gov
$2,200.00Was: $4,400.00 -
F&K Delvotec 6320 Automatic Gold Wire Bonder Nikon SMZ-1B CCD 1-2 Mil AS-IS
F&K Delvotek
$3,000.00Was: $6,000.00F&K Delvotec 6320 Automatic Gold Wire Bonder Nikon SMZ-1B CCD 1-2 Mil AS-ISAutomatic wire bonder for semiconductor IC packaging and microelectronics assembly. Performs thermosonic and...37228- SKU:
- 37228
- Availability:
- Usually ships within 3-5 business days — contact us to confirm freight arrangements for this large system.
- Weight:
- 956.00 LBS
- Brand:
- F&K Delvotec
- Model:
- 6320
- MPN:
- 6320.00.1648
- Type:
- Automatic Gold/Aluminum Wire Bonder
- SKU:
- 37228
- Condition:
- As-Is / For Parts or Not Working
- Seller Notes:
- Includes Nikon SMZ-1B scope, CCD camera, hot plate, Hitachi monitor, Philips monitor, K-Sine 1410 power supply
- Country/Region of Manufacture:
- Germany
- Power Requirements:
- 220V, 6A
- Wire Size Capability:
- 1 to 2 mil (approx.)
- Wire Material:
- Gold, Aluminum
- Bonding Method:
- Thermosonic / Thermocompression
- Form Factor:
- Benchtop / Cabinet System
- Included Scope:
- Nikon SMZ-1B Stereo Zoom Microscope
- Scope Eyepieces:
- 2x Unitron HWF 10x
- Imaging:
- CCD Video Camera Module
- Monitors Included:
- Hitachi Monitor, Philips Monitor
- Hot Plate:
- Corning Hot Plate (small crack, likely cosmetic)
- Power Supply:
- K-Sine 1410
- Control Interface:
- F&K Delvotec SC-02 controller, numeric keypad
- Gas Connections:
- Vacuum, Air, Forming Gas
- Linear Encoders:
- X and Y linear encoder connectors present (not communicating with PC)
- Floppy Drive:
- Integrated floppy disk drive on control cabinet
- Application:
- Semiconductor wire bonding, IC packaging, R&D, microelectronics
- Compatible With:
- Semiconductor die bonding, IC packaging, R&D assembly
- Serial Number:
- 6320.00.1648
- Condition Notes:
- F&K Delvotec 6320 Wire Bonder sold AS-IS for parts/repair. Powers on but computer cannot communicate with linear controllers. Cosmetic crack in hot plate. Includes Nikon SMZ-1B scope, CCD camera, 2 monitors, hot plate, K-Sine 1410 PSU. 220V/6A.
- California Prop 65 Warning:
- WARNING: This product can expose you to chemicals including lead and lead compounds, and DEHP (a phthalate), which are known to the State of California to cause cancer and birth defects or other reproductive harm. Go to P65Warnings.ca.gov
$3,000.00Was: $6,000.00 -
HyBond 614 616 Logic Control Card PCB Circuit Board Wire Bonder Replacement
HyBond
$125.00Was: $250.00HyBond 614 616 Logic Control Card PCB Circuit Board Wire Bonder ReplacementThis is a HyBond Inc. Logic Control Card, Model 614/616, a PCB replacement part for HyBond wire bonding systems. The board...34755- SKU:
- 34755
- Availability:
- Usually ships within 1–2 business days.
- Weight:
- 1.00 LBS
- Brand:
- Hybond
- Model:
- 614,616
- MPN:
- 614,616
- Type:
- Logic Control Card / PCB
- SKU:
- 34755
- Compatible With:
- HyBond Model 614 Wire Bonder
- Compatible With 2:
- HyBond Model 616 Wire Bonder
- Form Factor:
- Card / Module (edge connector)
- Application:
- Wire Bonding / Semiconductor Assembly
- Condition:
- Used – Pulled from Working Environment
- Seller Notes:
- Logic control card only; pulled from working HyBond wire bonder
- Country/Region of Manufacture:
- United States
- Condition Notes:
- HyBond 614/616 Logic Control Card PCB in good used condition. Pulled from a working wire bonder where it was in active use. Board is clean with no visible damage or missing components. Light bench wear.
- California Prop 65 Warning:
- WARNING: This product can expose you to chemicals including lead and lead compounds, and DEHP (a phthalate), which are known to the State of California to cause cancer and birth defects or other reproductive harm. Go to P65Warnings.ca.gov
$125.00Was: $250.00 -
Palomar Products MLS-375-F-125H Wedge Bonder Transducer Component
Palomar Products
$150.00Was: $300.00Palomar Products MLS-375-F-125H Wedge Bonder Transducer ComponentThis is a new open-box Palomar Products MLS-375-F-125H wedge bonder transducer component. The unit features a brass rectangular...26758- SKU:
- 26758
- Availability:
- Usually ships within 1-2 business days.
- Weight:
- 2.00 LBS
- Brand:
- Palomar Products
- Model:
- MLS-375-F-125H
- MPN:
- MLS-375-F-125H
- Type:
- Wedge Bonder Transducer Component
- SKU:
- 26758
- Condition:
- New – Open Box
- Seller Notes:
- New open-box component stored in foam-padded protective case with 3.5mm plug connector and lead wires.
- Compatible With:
- Palomar Products Wedge Bonders
- Application:
- Wire Bonding, Semiconductor Packaging, Microelectronics
- Connector Type:
- 3.5mm Mono Plug
- Form Factor:
- Handheld / Inline Transducer Component
- Country/Region of Manufacture:
- United States
- Condition Notes:
- Palomar Products MLS-375-F-125H wedge bonder transducer. New and unused, stored in foam-padded case. May be out of original manufacturer box. No signs of use or wear. Lead wires and connector intact.
- California Prop 65 Warning:
- WARNING: This product can expose you to chemicals including lead and lead compounds, and DEHP (a phthalate), which are known to the State of California to cause cancer and birth defects or other reproductive harm. Go to P65Warnings.ca.gov
$150.00Was: $300.00 -
Palomar Products ERS-32-55-TC Wedge Bonder Transducer Wire Bonding Tool
Palomar Products
$110.00Was: $225.00Palomar Products ERS-32-55-TC Wedge Bonder Transducer Wire Bonding ToolWedge bonder transducer component for ultrasonic wire bonding systems. This replacement transducer assembly converts electrical...26700- SKU:
- 26700
- Availability:
- Usually ships within 1-2 business days.
- Weight:
- 2.00 LBS
- Brand:
- Palomar Products
- Model:
- ERS-32-55-TC
- MPN:
- ERS-32-55-TC
- Type:
- Wedge Bonder Transducer
- SKU:
- 26700
- Seller Notes:
- Includes transducer body and lead wire assembly in foam-lined plastic case.
- Country/Region of Manufacture:
- United States
- Application:
- Ultrasonic wire bonding, semiconductor assembly
- Compatible With:
- Palomar wedge bonder systems
- Form Factor:
- Component / Replacement Part
- Condition:
- New – Open Box
- Condition Notes:
- Palomar Products ERS-32-55-TC Wedge Bonder Transducer. New and unused in foam storage case. May be out of original manufacturer packaging. No signs of use or wear.
- California Prop 65 Warning:
- WARNING: This product can expose you to chemicals including lead and lead compounds, and DEHP (a phthalate), which are known to the State of California to cause cancer and birth defects or other reproductive harm. Go to P65Warnings.ca.gov
$110.00Was: $225.00 -
HyBond 512-10-41 Manual Ball Bonder Wire Bonder Semiconductor Bonding Machine
HyBond
$941.00Was: $1,900.00HyBond 512-10-41 Manual Ball Bonder Wire Bonder Semiconductor Bonding MachineThe HyBond 512-10-41 is a benchtop manual ball bonder used for wire bonding in semiconductor assembly and microelectronics...22586- SKU:
- 22586
- Availability:
- Usually ships within 1-2 business days.
- Weight:
- 60.00 LBS
- Brand:
- Hybond
- Model:
- 512-10-41
- MPN:
- 512-10-41
- Type:
- Manual Ball Bonder / Wire Bonding Machine
- SKU:
- 22586
- Condition:
- Used – Inspected and Tested
- Seller Notes:
- No accessories included. Microscope head not included. Two fiber optic placeholders present on mount.
- Form Factor:
- Benchtop
- Application / Use Case:
- Semiconductor wire bonding, microelectronics assembly
- Bonding Method:
- Ball Bonding (Thermosonic / Thermocompression)
- Optics Mount:
- Nikon optics mount present (microscope head not included)
- Front Panel Controls:
- US Power, Stage Temp, Set Point, Test, Cal, Option, Spot, EFO Power, Power
- Bond Parameters:
- 1st/2nd bond, US (ultrasonic), Time, Force — all via front panel knobs
- Display:
- Red LED digital display (reads 983 in photos)
- Stage:
- Heated bonding stage with temperature control
- Country/Region of Manufacture:
- United States
- Condition Notes:
- HyBond 512-10-41 Manual Ball Bonder powers on; stage and mouse assembly function correctly; switches and indicators function. Could not test full bond cycle. No accessories or microscope head included. Moderate cosmetic wear.
- California Prop 65 Warning:
- WARNING: This product can expose you to chemicals including lead and lead compounds, and DEHP (a phthalate), which are known to the State of California to cause cancer and birth defects or other reproductive harm. Go to P65Warnings.ca.gov
$941.00Was: $1,900.00